Published December 7, 2021
| Version v1
Patent
Open
Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks
Creators
- 1. University of Chicago
Contributors
Patent applicant:
Description
Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.
Files
US11194059.pdf
Files
(586.6 kB)
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Additional details
Identifiers
- Patent number
- US 11194059 B2
- Patent application number
- US 202016842261 A
- Other
- oai:uchicago.tind.io:7355
Dates
- Patent filed
-
2020-04-07