Metallic substrates for high temperature superconductors

A biaxially textured face-centered cubic metal article having grain boundaries with misorientation angles greater than about 8° limited to less than about 1%. A laminate article is also disclosed having a metal substrate first rolled to at least about 95% thickness reduction followed by a first annealing at a temperature less than about 375° C. Then a second rolling operation of not greater than about 6% thickness reduction is provided, followed by a second annealing at a temperature greater than about 400° C. A method of forming the metal and laminate articles is also disclosed.