Published February 7, 1995 | Version v1
Patent Open

High thermal conductivity connector having high electrical isolation

  • 1. Argonne National Laboratory

Contributors

Patent applicant:

Description

A method and article for providing a low-thermal-resistance, high-electrical-isolation heat intercept connection. The connection method involves clamping, by thermal interference fit, an electrically isolating cylinder between an outer metallic ring and an inner metallic disk. The connection provides durable coupling of a heat sink and a heat source.

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Additional details

Identifiers

Patent application number
US 9042593 A
Patent number
US 5386870 A
Other
oai:uchicago.tind.io:9164

Dates

Patent filed
1993-07-12

UChicago Information

Division(s)
Physical Sciences Division
Department(s)
Chemistry, Physics